PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.
Micro-FCPGA
Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.
FC-LGA4 Package Type
The FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package. This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket. The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket.
Micro-FCPGA
The micro-FCPGA (Flip Chip Plastic Grid Array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.
Micro-FCBGA
Micro-FCBGA (Flip Chip Ball Grid Array) package for surface mount boards consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. Instead of using pins, the packages use small balls, which acts as contacts for the processor. The advantage of using balls instead of pins is that there are no leads that bend. The package uses 479 balls, which are .78 mm in diameter. Different from Micro-PGA, the micro-FCPGA includes capacitors on the top side.
FC-LGA4 Package Type
The FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package. This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket. The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket.
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